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Mobile Artifact Analysis

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Level:
Intermediate
Length:
2 Days (14 Hours)
Delivery:
In-Person / Virtual
Outcome:
Certificate of Completion

Upcoming Sessions

Region:
Virtual
Nov 12-15
Book Seat
In Person
Dec 02-05
Nairobi
Book Seat
In Person
Feb 01 - Feb 06, 2027
New York
Book Seat

Course Description

Master the essential skills for mobile device data extraction and basic analysis.

Learning Objectives

  • Identify when chip-off extraction is appropriate
  • Safely remove memory chips using milling
  • Clean and prepare memory chips (NAND, eMMC, UFS)

Critical Context

When severely damaged devices prevent standard workflows, chip-off techniques may be the only path.

Technical Focus

Milling & IR Heat Application Flash Memory Handling Data Analysis from Physical Extractions
Prerequisite

Completion of HexaBreach Foundational Forensics is strongly recommended.

Technical Equipment

Optional Practise Infrastructure

Optional Kits available. Includes milling/IR tools. Additional fees apply.

ADDITIONAL FEES APPLY NOT REQUIRED
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